Answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses, this title covers theoretical, numerical, and experimental analyses, includes descriptions of 12 air cooling enhancement techniques, and discusses the limiting roles of heat transfer, fluid flow, and thermal coupling in electronic enclosures.
Air Cooling Technology for Electronic Equipment answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses that are jargon-free and easy to understand, it covers theoretical, numerical, and experimental analyses, includes detailed descriptions of 12 air cooling enhancement techniques, and discusses the limiting roles of heat transfer, fluid flow, and thermal coupling in electronic enclosures.
